Make Better Focal Plane Arrays with ThermaView
ThermaView’s 90nm CMOS technology enables the unique design requirements of advanced ROICs, delivering state-of-the-art capabilities for large-format focal plane arrays in aerospace, defense, automotive, and broad-market industrial applications.
ThermaView S90LN Key Features
- 200 mm wafers
- 90 nm CMOS, 7 metal layers
- 1.2 V core; 1.8 V, 2.5 V and 3.3 V IO
- Temp range: -55°C to 125°C
- Cryogenic models: 77 K and 120 K
- Dual MIM caps: 2 fF/μM2
- Die stitching
- Planarized top vias
- Rad-tolerant by process up to: request radiation report
High-density routing technology maximizes component density within the pixel cell
Our ROIC platform employs two local interconnect layers — enabling short, efficient connections that perform like an additional routing layer, without the need for vias.
- 15% area improvement in chip density
- Enables high-density feature integration within each pixel
- Achieves ROIC chip density comparable to traditional 65 nm technologies
Specialized Support for Mission Systems Production Processes
- Support for low-rate, long life-cycle defense mission applications
- Security protocols for secure and Trusted programs
- DMEA Category 1A Trusted Supplier Accreditation
High-Volume, High-Performance for Industrial & Automotive Applications
- ThermaView ROICs provide the reliability and scalability to power advanced manufacturing and automation
- IATF16949 Automotive Certification
MPW Programs
SkyWater’s multi project wafer services enable customers to prototype pre-production concepts, verify IP, and characterize device performance with a low-cost, fast feedback loop.
MPW Programs
Custom, Device-Ready Chips from SkyWater’s Design Partner Network
